| Series | - |
| Package | Bulk |
| Part Status | Obsolete |
| Type | Board Level |
| Package Cooled | TO-263 (D²Pak) |
| Attachment Method | SMD Pad |
| Shape | Rectangular, Fins |
| Length | 0.763" (19.38mm) |
| Width | 1.000" (25.40mm) |
| Diameter | - |
| Fin Height | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise | 1.5W @ 20°C |
| Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural | - |
| Material | Copper |
| Material Finish | Tin |
