Series | - |
Package | Bulk |
Part Status | Obsolete |
Type | Board Level |
Package Cooled | TO-263 (D²Pak) |
Attachment Method | SMD Pad |
Shape | Rectangular, Fins |
Length | 0.590" (15.00mm) |
Width | 1.020" (25.91mm) |
Diameter | - |
Fin Height | 0.375" (9.52mm) |
Power Dissipation @ Temperature Rise | 2.0W @ 40°C |
Thermal Resistance @ Forced Air Flow | 5.00°C/W @ 400 LFM |
Thermal Resistance @ Natural | - |
Material | Copper |
Material Finish | Tin |
Rm 1099,Block A,BaoHua Building,
HuaQiang North Rd,Futian Dist, SZ, China.
© Copyright LinkElectronics, All Rights Reserved