655-53ABT6

Series655
PackageBulk
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Pin Fins
Length1.600" (40.64mm)
Width1.600" (40.64mm)
Diameter-
Fin Height0.525" (13.34mm)
Power Dissipation @ Temperature Rise4.0W @ 40°C
Thermal Resistance @ Forced Air Flow2.00°C/W @ 400 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

575603B00000G
BOARD LEVEL HEAT SINK
322805B00000G
BOARD LEVEL HEAT SINK
527-24AB-T725
HEATSINK DC/DC HALF BRICK VERT
341600F00000G
HEATSINK
500303B00000G
BOARD LEVEL HEAT SINK
1963839-2
GANGED QSFP SAN EXTRUSION HS 6
1963841-2
QSFP SINGLE PCI EXTRUSION HS 4
698-100AB
HEATSINK EXTRUSION 45MM
531002B02100G
BOARD LEVEL HEAT SINK
527-24AB-ME
HEATSINK DC/DC HALF BRICK VERT