500303B00000G

Series-
PackageBulk
Part StatusActive
TypeBoard Level
Package CooledTO-3
Attachment MethodBolt On
ShapeSquare, Pin Fins
Length1.810" (45.97mm)
Width1.810" (45.97mm)
Diameter-
Fin Height1.000" (25.40mm)
Power Dissipation @ Temperature Rise6.0W @ 40°C
Thermal Resistance @ Forced Air Flow1.50°C/W @ 700 LFM
Thermal Resistance @ Natural5.80°C/W
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

1963839-2
GANGED QSFP SAN EXTRUSION HS 6
1963841-2
QSFP SINGLE PCI EXTRUSION HS 4
698-100AB
HEATSINK EXTRUSION 45MM
531002B02100G
BOARD LEVEL HEAT SINK
527-24AB-ME
HEATSINK DC/DC HALF BRICK VERT
D10850-40T1E
HEATSINK 128PQFP COMPOSITE
507002B05300G
BOARD LEVEL HEAT SINK
537-95AB
HEATSINK DC DC 1/4 BRICK VERT
D10850-40T3
HEATSINK 128PQFP COMPOSITE
581102B02100G
BOARD LEVEL HEAT SINK