BDN14-3CB/A01

SeriesBDN
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length1.410" (35.81mm)
Width1.410" (35.81mm)
Diameter-
Fin Height0.355" (9.02mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow5.60°C/W @ 400 LFM
Thermal Resistance @ Natural16.20°C/W
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

530402B00150G
HEAT SINK 1.75" HIGH RISE TO-220
567-24AB
1/8 BRICK HEATSINK 55X20.7X6.1MM
6043BG
HEATSINK TO-220 LOCKING TAB CLIP
7139DG
HEATSINK TO-220 TIN CLIP-ON 13MM
R2V-CT4-38E
HEATSINK FOR TO-247
323005B00000G
HEATSINK TO-5 2W BLK
374324B00035G
HEATSINK BGA W/ADHESIVE TAPE