374324B00035G

Series37432
PackageBox
Part StatusActive
TypeBoard Level
Package CooledBGA, FPGA
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length1.063" (27.00mm)
Width1.063" (27.00mm)
Diameter-
Fin Height0.394" (10.00mm)
Power Dissipation @ Temperature Rise3.0W @ 90°C
Thermal Resistance @ Forced Air Flow9.30°C/W @ 200 LFM
Thermal Resistance @ Natural30.60°C/W
MaterialAluminum
Material FinishBlack Anodized

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