Contact us [email protected]
BOM

050055

Seriesconga-SA5/CSP-B
PackageBox
Part StatusActive
Accessory TypeHeat Sink
SpecificationsPassive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.

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     HuaQiang North Rd,Futian Dist, SZ, China.

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