Contact us [email protected]
BOM

050051

Seriesconga-SA5/i-CSP-B
PackageBox
Part StatusActive
Accessory TypeHeat Sink
SpecificationsPassive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

RELATED PRODUCT

016451
congatec
016451
HEATSINK W/12V FAN QSEVEN
050057
congatec
050057
SMARC 2.0 STANDARD HEATSPREADER
FWA8408/6 KIT5
iBASE Technology
FWA8408/6 KIT5
MODEL FWA8408, FWA8406, A: 1 X 3
FWA8408/6 KIT2
iBASE Technology
FWA8408/6 KIT2
MODEL FWA8408, FWA8406, A: NONE;
IB76-1
iBASE Technology
IB76-1
KIT, W/USB, COM, POWER CABLE, SA
IP327
iBASE Technology
IP327
RISER CARD, 1-TO-1 PCI-E EXPANSI
IP390-R
iBASE Technology
IP390-R
FC, PCIX1 + PCIE(X1)X1 RISER (PC
IB75
iBASE Technology
IB75
KIT, W/USB, COM, POWER CABLE, SA
ID107
iBASE Technology
ID107
FC, 6W AMPLIFIER BOARD, 12V DC-I
IB76A-1
iBASE Technology
IB76A-1
KIT, W/USB, COM, POWER CABLE, SA

CONTACT INFO

Rm 1099,Block A,BaoHua Building,
     HuaQiang North Rd,Futian Dist, SZ, China.

[email protected]

INFORMATION

Products

Service

© Copyright LinkElectronics, All Rights Reserved

Payment Support Image