Series | CHO-BOND® 2165 |
Package | Bulk |
Part Status | Active |
Type | EMI Conductive Sealant |
Shape | - |
Length | - |
Width | - |
Thickness - Overall | - |
Operating Temperature | - |
Adhesive | - |
Material | Polyurethane |
Rm 1099,Block A,BaoHua Building,
HuaQiang North Rd,Futian Dist, SZ, China.
© Copyright LinkElectronics, All Rights Reserved