SeriesSmartFusion®2
PackageTray
Part StatusActive
ArchitectureMCU, FPGA
Core ProcessorARM® Cortex®-M3
Flash Size512KB
RAM Size64KB
PeripheralsDDR, PCIe, SERDES
ConnectivityCANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed166MHz
Primary AttributesFPGA - 90K Logic Modules
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)

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