EX457014CB

Series-
PackageBulk
Part StatusObsolete
Type-
Package CooledFPGA
Attachment Method-
Shape-
Length-
Width-
Diameter-
Fin Height-
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
Material-
Material Finish-

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125565
6.818WX11.81" EXTRUSION 19333-12