Series | - |
Package | Bag |
Part Status | Active |
Type | Top Mount |
Package Cooled | BGA |
Attachment Method | Clip |
Shape | Cylindrical |
Length | - |
Width | - |
Diameter | 2.000" (50.80mm) OD |
Fin Height | 0.440" (11.18mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 5.72°C/W @ 200 LFM |
Thermal Resistance @ Natural | - |
Material | Aluminum |
Material Finish | - |
Rm 1099,Block A,BaoHua Building,
HuaQiang North Rd,Futian Dist, SZ, China.
© Copyright LinkElectronics, All Rights Reserved