Series302
PackageBulk
Part StatusActive
TypeBoard Level, Vertical
Package CooledStud Mounted Semiconductor Cases
Attachment MethodPress Fit
ShapeRectangular, Fins
Length2.000" (50.80mm)
Width1.500" (38.10mm)
Diameter-
Fin Height2.000" (50.80mm)
Power Dissipation @ Temperature Rise15.0W @ 50°C
Thermal Resistance @ Forced Air Flow1.80°C/W @ 250 LFM
Thermal Resistance @ Natural-
MaterialAluminum Alloy
Material FinishBlack Anodized

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