Series669
PackageBulk
Part StatusActive
TypeTop Mount
Package CooledSPGA
Attachment MethodClip, Thermal Material
ShapeSquare, Pin Fins
Length1.700" (43.18mm)
Width1.700" (43.18mm)
Diameter-
Fin Height0.315" (8.00mm)
Power Dissipation @ Temperature Rise6.0W @ 60°C
Thermal Resistance @ Forced Air Flow3.00°C/W @ 400 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishGold Iridite

RELATED PRODUCT

669-33AB
HEATSINK ASSY FOR SPGA
537-95AB-ME
HEATSINK DC/DC QUARTER BRICK
321127B00000
BOARD LEVEL HEAT SINK
AER21-21-21CB/A01
HEATSINK FORGED BLK ANO TOP MNT
AER21-21-23CB/A01
HEATSINK FORGED BLK ANO TOP MNT
APR27-27-15CB/A01
HEAT SINK FORGED W/PIN FINS
APR27-27-18CB/A01
HEATSINK FORGED BLK ANO TOP MNT
2328BG
HEAT SINK
AER21-21-28CB/A01
HEATSINK FORGED BLK ANO TOP MNT
AER21-21-33CB/A01
HEATSINK FORGED BLK ANO TOP MNT