662-15AGT3

Series662
PackageBulk
Part StatusActive
TypeTop Mount
Package CooledBGA
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length1.713" (43.51mm)
Width1.713" (43.51mm)
Diameter-
Fin Height0.150" (3.81mm)
Power Dissipation @ Temperature Rise2.0W @ 30°C
Thermal Resistance @ Forced Air Flow8.00°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishGold Iridite

RELATED PRODUCT

591302B04000G
BOARD LEVEL HEAT SINK
655-26ABT3
HEATSINK FOR 40MM BGA
655-26ABT5
HEATSINK FOR 40MM BGA
591202B03100G
BOARD LEVEL HEAT SINK
655-53ABT4E
HEATSINK FOR 40MM BGA
501906B00000G
BOARD LEVEL HEAT SINK
628-40ABT3
HEATSINK FOR 45MM BGA
D10650-40T3
HEATSINK 100PQFP COMPOSITE
579003B00000G
BOARD LEVEL HEAT SINK
662-15ABT3
HEATSINK EXTRUSION 45MM