Series662
PackageBulk
Part StatusActive
TypeTop Mount
Package CooledBGA
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length1.713" (43.51mm)
Width1.713" (43.51mm)
Diameter-
Fin Height0.150" (3.81mm)
Power Dissipation @ Temperature Rise2.0W @ 30°C
Thermal Resistance @ Forced Air Flow8.00°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

DA-T268-101E-TR
TO-268 HEAT SINK /POLY TAPE
530400B00100G
BOARD LEVEL HEAT SINK
628-35ABT3
HEATSINK FOR 45MM BGA
667-25ABPPE
HEATSINK TO-220 W/S/O PINS BLK
677-20ABPE
HEATSINK MULTIWATT 2.0" BLK
528-24AB
HEATSINK DC/DC HALF BRICK VERT
2342B
HEAT SINK
501806B00000G
BOARD LEVEL HEAT SINK
6084BG
BOARD LEVEL HEAT SINK
530510B00000G
BOARD LEVEL HEAT SINK