658-60ABT6

Series658
PackageBulk
Part StatusActive
TypeTop Mount
Package CooledBGA
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Pin Fins
Length1.100" (27.94mm)
Width1.100" (27.94mm)
Diameter-
Fin Height0.600" (15.24mm)
Power Dissipation @ Temperature Rise2.5W @ 30°C
Thermal Resistance @ Forced Air Flow2.00°C/W @ 500 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

7129DG
BOARD LEVEL HEAT SINK
DV-T263-301E-TR
HEATSINK D2PAK TO-263 DEGREASED
667-20ABPPE
HEATSINK TO-220 W/S/O PINS BLK
677-25ABP
HEATSINK MULTIWATT 2.5" BLK
628-25ABT4E
HEATSINK FOR 45MM BGA
628-25ABT5
HEATSINK FOR 45MM BGA
662-15AG
HEATSINK EXTRUSION 45MM
628-20ABT3
HEATSINK FOR 45MM BGA
628-25ABT1E
HEATSINK FOR 45MM BGA
628-35ABT4E
HEATSINK FOR 45MM BGA