530714B05300G

Series-
PackageBulk
Part StatusActive
TypeBoard Level
Package CooledTO-220
Attachment MethodBolt On and PC Pin
ShapeRectangular, Fins
Length0.710" (18.03mm)
Width0.955" (24.26mm)
Diameter-
Fin Height0.500" (12.70mm)
Power Dissipation @ Temperature Rise2.0W @ 40°C
Thermal Resistance @ Forced Air Flow4.00°C/W @ 700 LFM
Thermal Resistance @ Natural20.30°C/W
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

624-45ABT1E
HEATSINK FOR 21MM BGA
630-25ABT1E
HEATSINK FOR 35MM BGA
657-20ABPNE
HEATSINK TO-220 W/PINS BLK 2"
HSE-B18635-060H-W
HEAT SINK, EXTRUSION, TO-218, 63
624-25ABT3
HEATSINK FOR 21MM BGA
624-35ABT3
HEATSINK FOR 21MM BGA
624-60ABT1E
HEATSINK FOR 21MM BGA
625-35ABT1E
HEATSINK FOR 25MM BGA
626-15ABPE
HEATSINK FOR TO218/TO220
627-15ABPE
HEATSINK FOR TO218/TO220