529801B02100G

Series-
PackageBulk
Part StatusActive
TypeBoard Level, Vertical
Package CooledTO-218
Attachment MethodBolt On and PC Pin
ShapeRectangular, Fins
Length1.500" (38.10mm)
Width1.650" (41.91mm)
Diameter-
Fin Height1.000" (25.40mm)
Power Dissipation @ Temperature Rise5.0W @ 30°C
Thermal Resistance @ Forced Air Flow3.00°C/W @ 200 LFM
Thermal Resistance @ Natural5.00°C/W
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

630-60AB
HEATSINK FOR BGA 35MM
634-15AB
HEATSINK SLIM VERT BLACK TO-220
V2200N1-F-LP
HEATSINK CPU W/ADHESIVE STAMPED
624-35ABT1E
HEATSINK FOR 21MM BGA
630-25ABT3
HEATSINK FOR 35MM BGA
630-25ABT4E
HEATSINK FOR 35MM BGA
513101B02500G
BOARD LEVEL HEAT SINK
579704B00000G
BOARD LEVEL HEAT SINK
566010B00000G
BOARD LEVEL HEAT SINK
552703B00000
BOARD LEVEL HEAT SINK