V2136N1-F-LP

Series-
PackageBulk
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Fins
Length1.575" (40.00mm)
Width1.575" (40.00mm)
Diameter-
Fin Height0.394" (10.00mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
MaterialAluminum Alloy
Material FinishNatural Anodized

RELATED PRODUCT

XL25-40-40-2.0
XL25 CERAMIC BOARD 40X40X2MM
625-60AB
HEATSINK FOR 25MM BGA
HSE-B630-04H
HEAT SINK, EXTRUSION, TO-220, 63
634-10AB
HEATSINK TO-220 VERT MT BLK 1"
690-3B
HEATSINK EXTRUSION
HSE-B18635-035H-04
HEAT SINK, EXTRUSION, TO-218, 63
630-45AB
HEATSINK FOR BGAS FIN HGT .45"
HSE-B18635-035H
HEAT SINK, EXTRUSION,TO-218, 63.
624-25ABT1E
HEATSINK FOR 21MM BGA