513301B02500G

Series-
PackageBulk
Part StatusActive
TypeBoard Level, Vertical
Package CooledTO-218, TO-247
Attachment MethodBolt On and PC Pin
ShapeRectangular, Fins
Length2.500" (63.50mm)
Width1.375" (34.93mm)
Diameter-
Fin Height0.500" (12.70mm)
Power Dissipation @ Temperature Rise8.0W @ 60°C
Thermal Resistance @ Forced Air Flow4.00°C/W @ 200 LFM
Thermal Resistance @ Natural8.00°C/W
MaterialAluminum
Material FinishBlack Anodized

RELATED PRODUCT

HSE-B20381-040H
HEAT SINK, EXTRUSION,TO-220, 38.
660-29AB
HEATSINK EXTRUSION 37MM
V2200N1-F
HEATSINK CPU W/ADHESIVE STAMPED
XL25-40-40-10
CERAMIC HEAT SPREADER 40X40MM GR
580400B00000G
HEATSINK 20-DIP BLK ANODIZED
513302B02500G
BOARD LEVEL HEAT SINK
HSE-B18381-035H
HEAT SINK, EXTRUSION, TO-218, 38
6238BG
BOARD LEVEL HEAT SINK
HSE-B18254-0396H
HEAT SINK, EXTRUSION,TO-218, 25.
624-35AB
HEATSINK FOR 21MM BGA