HSF-55-30-Y-F

SeriesHSF
PackageBulk
Part StatusActive
TypeTop Mount
Package CooledBGA
Attachment MethodClip
ShapeSquare, Fins
Length2.165" (55.00mm)
Width2.165" (55.00mm)
Diameter-
Fin Height1.185" (30.10mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural0.70°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

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