114992049

SeriesICE Tower
PackageBulk
Part StatusActive
TypeBoard Level
Package CooledNvidia Jetson Nano
Attachment MethodClip
Shape-
Length-
Width-
Diameter-
Fin Height-
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
Material-
Material Finish-

RELATED PRODUCT

342941
COPPER HEATSINK 40X40.5X13.5MM
125350
2.28WX36" EXTRUSION 14228
125344
2.22WX36" EXTRUSION 14192
HSF-48-19-Y-F
FANSINK 5VDC 47.5X47.5X18.5MM
615652F00000G
61565 EXTRUSION 0.19X0.25"X4'
HSF-48-30-B-F
FANSINK 5VDC 47.5X47.5X29.5MM
HSF-50-40-B-F
FANSINK 5VDC 50X50X39.5MM
HSF-55-45-Y-F
FANSINK 12VDC 55X55X45.1MM
125421
6.624WX12" EXTRUSIO 16524 XX7031