Series | PH3 |
Package | Bulk |
Part Status | Active |
Type | Heat Spreader |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Adhesive |
Shape | Rectangular |
Length | 3.000" (76.20mm) |
Width | 0.750" (19.05mm) |
Diameter | - |
Fin Height | 0.008" (0.21mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | - |
Thermal Resistance @ Natural | - |
Material | Copper |
Material Finish | Polyester |
Rm 1099,Block A,BaoHua Building,
HuaQiang North Rd,Futian Dist, SZ, China.
© Copyright LinkElectronics, All Rights Reserved