BDN18-3CB/A01

SeriesBDN
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length1.810" (45.97mm)
Width1.810" (45.97mm)
Diameter-
Fin Height0.355" (9.02mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow3.50°C/W @ 400 LFM
Thermal Resistance @ Natural10.80°C/W
MaterialAluminum
Material FinishBlack Anodized

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