BDN09-3CB

SeriesBDN
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Pin Fins
Length0.910" (23.11mm)
Width0.910" (23.11mm)
Diameter-
Fin Height0.355" (9.02mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow9.60°C/W @ 400 LFM
Thermal Resistance @ Natural26.90°C/W
MaterialAluminum
Material FinishBlack Anodized

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