Series-
PackageBulk
Part StatusActive
TypeTop Mount
Package CooledTO-263 (D²Pak), PowerSO-10 (MO-184), SO-10
Attachment MethodSMD Pad
ShapeRectangular, Fins
Length0.590" (15.00mm)
Width1.020" (25.91mm)
Diameter-
Fin Height0.375" (9.52mm)
Power Dissipation @ Temperature Rise2.0W @ 40°C
Thermal Resistance @ Forced Air Flow5.00°C/W @ 400 LFM
Thermal Resistance @ Natural-
MaterialCopper
Material FinishTin

RELATED PRODUCT

6025DG
HEATSINK TO-220 STAGGEREDFIN TIN
529802B02500G
HEATSINK TO-220 W/PINS 1.5"TALL
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
637-15ABPE
HEATSINK TO-220 VRT MT BLK 1.5"
531002B02500G
HEATSINK TO-220 W/PINS 1" TALL
DA-T263-201E-TR
HEATSINK FOR TO-263
531202B02500G
HEATSINK TO-220 POWER W/PINS BK
647-15ABPE
HEATSINK TO-220 W/PINS BLK 1.5"
624-25ABT4E
HEATSINK CPU 21MM SQ W/DBL TAPE
624-45ABT3
HEATSINK CPU 21MM SQ W/ADH BLK